Products Features
Epoxy Resins & Polyamide
DESCRIPTION -
MOC- BOND MG-365 is modified liquid epoxy resin and MOC-BOND MH-751 is a very low viscosity aliphatic polyamine hardener , MOC-BOND MH-772 is a low viscosity aromatic polyamide based curing agent and MOC-BOND MH-701 solid acid anhydride hardener. The system cures without releasing volatile matter, shrinkage is very low and may be further reduced by the addition of filters such as silica flour, china clay etc. .
Specification
APPLICATIONS:-
MOC-BOND MG-356 is cold curing used for coating slip rings, small electronics components , insulators ,coils, transformers, dry capacitors etc.
CHARACTERISTICS:
|
S.No. |
Product |
Appearance |
Viscosity at |
Amine Value / EEW |
Specific |
|
1. |
MOC-BOND |
Clear liquid |
8000-10000 |
175-195 |
1.15 |
|
2. |
MOC-BOND |
Clear liquid |
10-27 |
250 |
0.98-1.02 |
|
3. |
MOC-BOND MH-772 |
Clear liquid |
89-92 |
250 |
0.8-0.9 |
|
4. |
MOC-BOND MH-701 |
Solid white Crystal |
- |
- |
1.50-1.58 |
PROPERTIES AFTER CURE:-
|
S.No. |
Properties |
Unit |
Value |
|
1 |
Tensile Strength |
Kg/mm2 |
3.5-5.0 |
|
2. |
Compressive Strength |
Kg/mm2 |
10-11 |
|
3. |
Flexural Strength |
Kg/mm2 |
5-6 |
|
4. |
Impact Strength |
Kg.cm/cm2 |
2.5-4.0 |
STORAGE & PRECAUTIONS:-
1.More than 12 months when stored in cool and dry conditions.
2.Use of hand gloves during handling of resin and hardener.
3.Avoid direct contact of resin/ hardener/accelerator with skin.
4.Splashes on the skin if any, should be removed immediately with soap, lukewarm water or a suitable remover.